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:: Through-silicon Vias For 3d Integration Pdf Free ::

 
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MessagePosté le: Dim 25 Sep - 09:56 (2016)    Sujet du message: Through-silicon Vias For 3d Integration Pdf Free Répondre en citant




Through-silicon Vias For 3d Integration Pdf Free > bit.ly/2dtdK5v















































Through-silicon Vias For 3d Integration Pdf Free

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In...most...3D...packages,...the...stacked...chips...are...wired...together...along...their...edges;...this...edge...wiring...slightly...increases...the...length...and...width...of...the...package...and...usually...requires...an...extra...interposer...layer...between...the...chips....When...we...need...it...the...most......for...portable...computing,...memory...cards,...smart...cards,...cellular...phones,...and...other...uses......we...can...follow...Moores...Law...into...the...Z...dimension....The...book...proposes...that...every...chip...or...interposer...could...have...two...surfaces...with...circuits.This...detailed...guide...discusses...TSV...manufacturing...yield...and...hidden...costs...and...includes...characterization...and...reliability...data...for...3D...IC...integration....If...you...find...anything...wrong...with...this...product...listing,...perhaps...the...description...is...wrong,...the...author...is...incorrect,...or...it...is...listed...in...the...wrong...category,...then...please...contact...us....Image...sensors[edit]....

A..3D..integrated..circuit..(3D..IC)..is..a..single..integrated..circuit..built..by..stacking..silicon..wafers..and/or..dies..and..interconnecting..them..vertically..so..that..they..behave..as..a..single..device...TSVs...are...a...high...performance...interconnect...techniques...used...as...an...alternative...to...wire-bond...and...flip...chips...to...create...3D...packages...and...3D...integrated...circuits,...compared...to...alternatives...such...as...package-on-package,...because...the...density...of...the...vias...is...substantially...higher,...and...because...the...length...of...the...connections...is...shorter....References[edit]...The..latest..cost-..and..space-saving..methods..of..3D..integrated..circuitsThrough-Silicon..Vias..(TSVs)..for..3D..Integration..covers..cutting-edge..developments..in..3D..ICs-essential..for..the..development..of..low-cost,..high-performance..electronic..and..optoelectronic..products...TSVs...used...by...stacked...DRAM-dice...in...combination...with...a...High...Bandwidth...Memory...interface.......History...of...the...term[edit]....The....different....devices....in....the....stack....may....be....heterogeneous,....e.g.....von..Trapp,..The..Future..Of..Image..Sensors..is..Chip..Stacking..^..Desjardins,..Emily...This....TSV....technique....is....sometimes....also....referred....to....as....TSS....(Through-Silicon....Stacking....or....Thru-Silicon....Stacking).....It....is....a....free....software.....

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